发明授权
- 专利标题: Silicon based optical vias
- 专利标题(中): 硅基光通孔
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申请号: US12080266申请日: 2008-04-01
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公开(公告)号: US08755644B2公开(公告)日: 2014-06-17
- 发明人: Russell A. Budd , Punit P. Chiniwalla , Chirag S. Patel
- 申请人: Russell A. Budd , Punit P. Chiniwalla , Chirag S. Patel
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Thomas A. Beck; Daniel P. Morris
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; H01L21/00 ; H01L23/48
摘要:
Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.
公开/授权文献
- US20100322551A1 Silicon based optical vias 公开/授权日:2010-12-23