发明授权
- 专利标题: Connection structure and a connection method for connecting a differential signal transmission cable to a circuit board
- 专利标题(中): 连接结构和将差分信号传输电缆连接到电路板的连接方法
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申请号: US13373043申请日: 2011-11-03
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公开(公告)号: US08758051B2公开(公告)日: 2014-06-24
- 发明人: Hideki Nonen , Takahiro Sugiyama , Takashi Kumakura
- 申请人: Hideki Nonen , Takahiro Sugiyama , Takashi Kumakura
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Metals, Ltd.
- 当前专利权人: Hitachi Metals, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: McGinn IP Law Group, PLLC
- 优先权: JP2010-248452 20101105
- 主分类号: H01R13/40
- IPC分类号: H01R13/40
摘要:
A connection structure for connecting a differential signal transmission cable to a circuit board. A differential signal transmission cable includes an outer conductor provided around a pair of signal line conductors via an insulator. Parts of the signal line conductors are exposed from a tip of the differential signal transmission cable. A circuit board is provided with a pair of signal pads and a ground pad. A shield-connecting terminal includes a main body which is crimp-connected to the outer conductor and a solder-connecting pin which is solder-connected to the ground pad. The exposed parts of the signal line conductors are solder-connected to the signal pads, respectively, and the outer conductor is solder-connected to the ground pad via the solder-connecting pin of the shield-connecting terminal.
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