发明授权
US08758087B2 Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
失效
晶片加工方法，晶片抛光装置和锭切片装置
- 专利标题： Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
- 专利标题（中）： 晶片加工方法，晶片抛光装置和锭切片装置
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申请号： US13114141申请日： 2011-05-24
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公开(公告)号： US08758087B2公开(公告)日： 2014-06-24
- 发明人: Kyohei Koutake , Hiromichi Morita , Fumiyoshi Kano , Tetsuji Yamaguchi , Sumitomo Inomata , Masatake Nagaya
- 申请人： Kyohei Koutake , Hiromichi Morita , Fumiyoshi Kano , Tetsuji Yamaguchi , Sumitomo Inomata , Masatake Nagaya
- 申请人地址： JP Kariya
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya
- 代理机构： Posz Law Group, PLC
- 优先权： JP2010-119204 20100525
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24B49/16
摘要：
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.