Invention Grant
- Patent Title: Light emitting diode chip, light emitting diode package structure, and method for forming the same
- Patent Title (中): 发光二极管芯片，发光二极管封装结构及其形成方法
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Application No.: US13806703Application Date: 2011-08-03
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Publication No.: US08759865B2Publication Date: 2014-06-24
- Inventor: Yao-Jun Tsai , Chen-Peng Hsu , Kuo-Feng Lin , Hsun-Chih Liu , Ji-Feng Chen , Hung-Lieh Hu , Chien-Jen Sun
- Applicant: Yao-Jun Tsai , Chen-Peng Hsu , Kuo-Feng Lin , Hsun-Chih Liu , Ji-Feng Chen , Hung-Lieh Hu , Chien-Jen Sun
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: WOPCT/CN2010/075684 20100803
- International Application: PCT/CN2011/077974 WO 20110803
- International Announcement: WO2012/016525 WO 20120209
- Main IPC: H01L33/20
- IPC: H01L33/20 ; H01L33/38 ; H01L33/48 ; H01L33/10 ; H01L33/62 ; H01L33/00
Abstract:
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.
Public/Granted literature
- US20130087823A1 LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME Public/Granted day:2013-04-11
Information query
IPC分类:
