发明授权
- 专利标题: Nitride semiconductor device and method for manufacturing same
- 专利标题(中): 氮化物半导体器件及其制造方法
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申请号: US13238684申请日: 2011-09-21
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公开(公告)号: US08759878B2公开(公告)日: 2014-06-24
- 发明人: Yasunobu Saito , Hidetoshi Fujimoto , Tetsuya Ohno , Akira Yoshioka , Wataru Saito
- 申请人: Yasunobu Saito , Hidetoshi Fujimoto , Tetsuya Ohno , Akira Yoshioka , Wataru Saito
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Patterson & Sheridan, LLP
- 优先权: JP2011-014280 20110126
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
According to one embodiment, a nitride semiconductor device includes a first semiconductor, a second semiconductor layer, a third semiconductor layer, a fourth semiconductor layer, a first electrode, a second electrode and a third electrode. The first, second and fourth semiconductor layers include a nitride semiconductor. The second semiconductor layer is provided on the first semiconductor layer, has a band gap not less than that of the first semiconductor layer. The third semiconductor layer is provided on the second semiconductor layer. The third semiconductor layer is GaN. The fourth semiconductor layer is provided on the third semiconductor layer to have an interspace on a part of the third semiconductor layer, has a band gap not less than that of the second semiconductor layer. The first electrode is provided on a portion of the third semiconductor layer. The fourth semiconductor layer is not provided on the portion.