Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US12658646Application Date: 2010-02-12
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Publication No.: US08759958B2Publication Date: 2014-06-24
- Inventor: Dong-Ki Ho , Boseong Kim
- Applicant: Dong-Ki Ho , Boseong Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2009-0014454 20090220
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.
Public/Granted literature
- US20100213591A1 Semiconductor package and method of manufacturing the same Public/Granted day:2010-08-26
Information query
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