Invention Grant
US08759968B2 Semiconductor memory apparatus for controlling pads and multi-chip package having the same
有权
用于控制焊盘的半导体存储装置和具有其的多芯片封装
- Patent Title: Semiconductor memory apparatus for controlling pads and multi-chip package having the same
- Patent Title (中): 用于控制焊盘的半导体存储装置和具有其的多芯片封装
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Application No.: US13243755Application Date: 2011-09-23
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Publication No.: US08759968B2Publication Date: 2014-06-24
- Inventor: Tae-Yong Lee
- Applicant: Tae-Yong Lee
- Applicant Address: KR
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR
- Agency: Baker & McKenzie LLP
- Priority: KR10-2008-0077703 20080808
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor memory apparatus includes a first pad group located along a first edge of a plurality of banks, a second pad group located along a second edge of the plurality of banks opposite the first pad group, and a pad control section configured to provide first and second bonding signals and to implement control operation in response to a test mode signal and a bonding option signal to selectively employ signals from the first and second pad groups.
Public/Granted literature
- US20120012844A1 SEMICONDUCTOR MEMORY APPARATUS FOR CONTROLLING PADS AND MULTI-CHIP PACKAGE HAVING THE SAME Public/Granted day:2012-01-19
Information query
IPC分类:
