Invention Grant
US08760181B2 Semiconductor system and device for identifying stacked chips and method thereof
有权
用于识别堆叠芯片的半导体系统和装置及其方法
- Patent Title: Semiconductor system and device for identifying stacked chips and method thereof
- Patent Title (中): 用于识别堆叠芯片的半导体系统和装置及其方法
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Application No.: US12914424Application Date: 2010-10-28
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Publication No.: US08760181B2Publication Date: 2014-06-24
- Inventor: Sang-Jin Byeon , Jong-Chern Lee
- Applicant: Sang-Jin Byeon , Jong-Chern Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2010-0065435 20100707
- Main IPC: G01R31/36
- IPC: G01R31/36 ; G11C5/02

Abstract:
A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.
Public/Granted literature
- US20120007624A1 SEMICONDUCTOR SYSTEM AND DEVICE FOR IDENTIFYING STACKED CHIPS AND METHOD THEREOF Public/Granted day:2012-01-12
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