Invention Grant
- Patent Title: Method of fabricating touch panel
- Patent Title (中): 制造触摸屏的方法
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Application No.: US13956381Application Date: 2013-08-01
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Publication No.: US08763237B2Publication Date: 2014-07-01
- Inventor: Yu-Feng Chien , Zeng-De Chen , Tun-Chun Yang , Seok-Lyul Lee
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99132435A 20100924
- Main IPC: H01H11/00
- IPC: H01H11/00 ; H01H65/00

Abstract:
A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, and second meshed metal sensing pads is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A plurality of second transparent bridge lines are formed on the insulating layer located in the touch-sensing region. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. The second transparent bridge lines completely cover the portion of the second meshed metal sensing pads exposed by the first contact windows.
Public/Granted literature
- US20130312253A1 METHOD OF FABRICATING TOUCH PANEL Public/Granted day:2013-11-28
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