A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC. In addition, the hybrid thermoelectric ejector active cooling system will be able to operate at higher temperature differentials than standalone thermoelectric cooling devices.