Invention Grant
- Patent Title: Copper nanowire preparation methods and compositions
- Patent Title (中): 铜纳米线制备方法和组成
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Application No.: US13764820Application Date: 2013-02-12
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Publication No.: US08764878B2Publication Date: 2014-07-01
- Inventor: David R. Whitcomb
- Applicant: David R. Whitcomb
- Agent Reed L. Christiansen
- Main IPC: C22B15/00
- IPC: C22B15/00 ; B22F1/00 ; B22F9/24 ; B22F9/16 ; C30B7/14 ; C30B29/62
Abstract:
Claimed methods do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.
Public/Granted literature
- US20130230737A1 COPPER NANOWIRE PREPARATION METHODS AND COMPOSITIONS Public/Granted day:2013-09-05
Information query
