Invention Grant
- Patent Title: Manufacturing methods for metal clad laminates
- Patent Title (中): 金属复合层压板的制造方法
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Application No.: US12376892Application Date: 2007-08-02
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Publication No.: US08764960B2Publication Date: 2014-07-01
- Inventor: Kwang-Choon Chung , Hyun-Nam Cho , Seong-Yong Uhm
- Applicant: Kwang-Choon Chung , Hyun-Nam Cho , Seong-Yong Uhm
- Applicant Address: KR
- Assignee: Inktec Co., Ltd.
- Current Assignee: Inktec Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2006-0074311 20060807; KR10-2006-0074388 20060807
- International Application: PCT/KR2007/003737 WO 20070802
- International Announcement: WO2008/018719 WO 20080214
- Main IPC: C23C28/02
- IPC: C23C28/02 ; C25D5/02
Abstract:
The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.
Public/Granted literature
- US20100261031A1 MANUFACTURING METHODS FOR METAL CLAD LAMINATES Public/Granted day:2010-10-14
Information query
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