Invention Grant
- Patent Title: Method for fabricating fin-shaped field-effect transistor
- Patent Title (中): 制造鳍状场效应晶体管的方法
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Application No.: US13925812Application Date: 2013-06-24
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Publication No.: US08765546B1Publication Date: 2014-07-01
- Inventor: Ching-Wen Hung , Jia-Rong Wu , Chih-Sen Huang
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A method for fabricating fin-shaped field-effect transistor (FinFET) is disclosed. The method includes the steps of: providing a substrate; forming a fin-shaped structure on the substrate; forming a first gate structure on the fin-shaped structure; forming a first epitaxial layer in the fin-shaped structure adjacent to the first gate structure; forming an interlayer dielectric layer on the first gate structure and the first epitaxial layer; forming an opening in the interlayer dielectric layer to expose the first epitaxial layer; forming a silicon cap on the first epitaxial layer; and forming a contact plug in the opening.
Information query
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