发明授权
- 专利标题： Method of manufacturing a semiconductor component and structure
- 专利标题（中）： 制造半导体元件和结构的方法
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申请号： US12896416申请日： 2010-10-01
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公开(公告)号： US08766401B2公开(公告)日： 2014-07-01
- 发明人: Phillip Holland , Rong Liu , Umesh Sharma , Der Min Liou , David D. Marreiro , Sudhama C. Shastri
- 申请人： Phillip Holland , Rong Liu , Umesh Sharma , Der Min Liou , David D. Marreiro , Sudhama C. Shastri
- 申请人地址： US AZ Phoenix
- 专利权人： Semiconductor Components Industries, LLC
- 当前专利权人： Semiconductor Components Industries, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理商 Rennie William Dover
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/48
摘要：
A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
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