- 专利标题: Three-dimensional macro-chip including optical interconnects
- 专利标题(中): 三维宏片包括光互连
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申请号: US13566598申请日: 2012-08-03
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公开(公告)号: US08768123B2公开(公告)日: 2014-07-01
- 发明人: Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
- 申请人: Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
- 申请人地址: US CA Redwood Shores
- 专利权人: Oracle International Corporation
- 当前专利权人: Oracle International Corporation
- 当前专利权人地址: US CA Redwood Shores
- 代理机构: Park, Vaughan, Fleming & Dowler LLP
- 代理商 Steven E. Stupp
- 主分类号: G02B6/02
- IPC分类号: G02B6/02
摘要:
A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
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