发明授权
- 专利标题: Method of making conductive pattern
- 专利标题(中): 制作导电图案的方法
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申请号: US12842103申请日: 2010-07-23
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公开(公告)号: US08769805B2公开(公告)日: 2014-07-08
- 发明人: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- 申请人: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- 申请人地址: US CA Glendale
- 专利权人: Avery Dennison Corporation
- 当前专利权人: Avery Dennison Corporation
- 当前专利权人地址: US CA Glendale
- 代理机构: Avery Dennison Corporation
- 主分类号: H01P11/00
- IPC分类号: H01P11/00 ; H01Q13/00
摘要:
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
公开/授权文献
- US20100283615A1 Conductive Pattern and Method of Making 公开/授权日:2010-11-11
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