发明授权
- 专利标题： Electronic device and manufacturing method thereof
- 专利标题（中）： 电子装置及其制造方法
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申请号： US13561266申请日： 2012-07-30
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公开(公告)号： US08771436B2公开(公告)日： 2014-07-08
- 发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- 申请人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- 申请人地址： TW Hsinchu
- 专利权人： Cyntec Co., Ltd.
- 当前专利权人： Cyntec Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： TW98116158A 20090515
- 主分类号： H01F1/22
- IPC分类号： H01F1/22 ; H01F1/153 ; H01F27/255
摘要：
An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
公开/授权文献
- US20120299687A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2012-11-29
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