发明授权
- 专利标题: Method of producing substrate for liquid ejection head
- 专利标题(中): 液体喷射头用基材的制造方法
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申请号: US13433806申请日: 2012-03-29
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公开(公告)号: US08771531B2公开(公告)日: 2014-07-08
- 发明人: Kenta Furusawa , Shuji Koyama , Hiroyuki Abo , Taichi Yonemoto
- 申请人: Kenta Furusawa , Shuji Koyama , Hiroyuki Abo , Taichi Yonemoto
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2011-093014 20110419
- 主分类号: B41J2/16
- IPC分类号: B41J2/16
摘要:
A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.
公开/授权文献
- US20120267342A1 METHOD OF PRODUCING SUBSTRATE FOR LIQUID EJECTION HEAD 公开/授权日:2012-10-25
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