Invention Grant
US08772884B2 Integrally molded die and bezel structure for fingerprint sensors and the like
有权
用于指纹传感器等的整体模制模具和表圈结构
- Patent Title: Integrally molded die and bezel structure for fingerprint sensors and the like
- Patent Title (中): 用于指纹传感器等的整体模制模具和表圈结构
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Application No.: US13960405Application Date: 2013-08-06
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Publication No.: US08772884B2Publication Date: 2014-07-08
- Inventor: Robert Henry Bond , Alan Kramer , Giovanni Gozzini
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. Attorneys at Law
- Main IPC: H01L23/31
- IPC: H01L23/31
Abstract:
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
Public/Granted literature
- US20130320464A1 INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE Public/Granted day:2013-12-05
Information query
IPC分类:
