发明授权
US08772925B2 Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
有权
散热构件的接合结构和接合方法，以及使用其的冷却单元
- 专利标题： Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
- 专利标题（中）： 散热构件的接合结构和接合方法，以及使用其的冷却单元
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申请号： US13325423申请日： 2011-12-14
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公开(公告)号： US08772925B2公开(公告)日： 2014-07-08
- 发明人: Koji Noda , Satoshi Sakimichi , Masahiro Sakamoto , Kimio Kohara
- 申请人： Koji Noda , Satoshi Sakimichi , Masahiro Sakamoto , Kimio Kohara
- 申请人地址： JP Kariya JP Nishio
- 专利权人： DENSO CORPORATION,Nippon Soken, Inc.
- 当前专利权人： DENSO CORPORATION,Nippon Soken, Inc.
- 当前专利权人地址： JP Kariya JP Nishio
- 代理机构： Harness, Dickey & Pierce, PLC
- 优先权： JP2010-280815 20101216; JP2011-153181 20110711
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34 ; H01L23/36 ; H01L23/367
摘要：
A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.
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