Invention Grant
US08774944B2 Tools, systems, and methods for inserting an electrode array portion of a lead into a bodily orifice
有权
用于将铅的电极阵列部分插入身体孔口的工具,系统和方法
- Patent Title: Tools, systems, and methods for inserting an electrode array portion of a lead into a bodily orifice
- Patent Title (中): 用于将铅的电极阵列部分插入身体孔口的工具,系统和方法
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Application No.: US12824122Application Date: 2010-06-25
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Publication No.: US08774944B2Publication Date: 2014-07-08
- Inventor: Chuladatta Thenuwara , Rosa Gallegos , Timothy Beerling
- Applicant: Chuladatta Thenuwara , Rosa Gallegos , Timothy Beerling
- Applicant Address: CH Zug
- Assignee: Advanced Bionics AG
- Current Assignee: Advanced Bionics AG
- Current Assignee Address: CH Zug
- Agency: ALG Intellectual Property, LLC
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61B17/34

Abstract:
Exemplary insertion tools, systems, and methods for inserting an electrode array portion of a lead into a bodily orifice are described herein. An exemplary insertion tool includes a handle assembly, a retractor assembly disposed at least partially within the handle assembly, and a slider assembly disposed at least partially within the handle assembly. The retractor assembly may include a stiffening member configured to be inserted into an electrode array portion and a spring-loaded retractor member coupled to the stiffening member and configured to move from a distal position to a proximal position to at least partially retract the stiffening member from the electrode array portion. The slider assembly may be configured to selectively retain the spring-loaded retractor member and further configured to release the spring-loaded retractor member to move from the distal position to the proximal position in response to actuation by a user of the slider assembly.
Public/Granted literature
- US20110319974A1 TOOLS, SYSTEMS, AND METHODS FOR INSERTING AN ELECTRODE ARRAY PORTION OF A LEAD INTO A BODILY ORIFICE Public/Granted day:2011-12-29
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