发明授权
- 专利标题： Housing components for electronic devices
- 专利标题（中）： 电子设备的外壳部件
-
申请号： US12186990申请日： 2008-08-06
-
公开(公告)号： US08776358B2公开(公告)日： 2014-07-15
- 发明人: Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- 申请人： Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Womble Carlyle Sandridge & Rice LLP
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; H05K5/04
摘要：
Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.
公开/授权文献
信息查询
