发明授权
- 专利标题： Cutting instrument
- 专利标题（中）： 切割仪器
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申请号： US12994032申请日： 2008-10-02
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公开(公告)号： US08776382B2公开(公告)日： 2014-07-15
- 发明人: Hiroyuki Ochiai , Mitsutoshi Watanabe , Takashi Furukawa , Hiroki Yoshizawa , Yukihiro Shimoda , Sadao Doi
- 申请人： Hiroyuki Ochiai , Mitsutoshi Watanabe , Takashi Furukawa , Hiroki Yoshizawa , Yukihiro Shimoda , Sadao Doi
- 申请人地址： JP Tokyo
- 专利权人： IHI Corporation
- 当前专利权人： IHI Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 国际申请： PCT/JP2008/067932 WO 20081002
- 国际公布： WO2010/038300 WO 20100408
- 主分类号： B25G3/00
- IPC分类号： B25G3/00 ; B26B9/00
摘要：
A cutting instrument has a cutting blade portion formed with a skin made of an electrode material or a reaction product of the electrode material, the electrode material having been molten by pulse discharges induced between the cutting blade portion and an electrode in a machining liquid or gas, having as the electrode one of a mold molded from powder of a kind or powder of a mixture of kinds out of a metal or metals, a metal compound or metal compounds, and a ceramic or ceramics, and a heat-treated mold being the mold as heat-treated.
公开/授权文献
- US20110232108A1 CUTTING INSTRUMENT 公开/授权日：2011-09-29
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