Invention Grant
- Patent Title: Coplanar process fluid pressure sensor module
- Patent Title (中): 共面工艺流体压力传感器模块
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Application No.: US13285775Application Date: 2011-10-31
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Publication No.: US08776608B2Publication Date: 2014-07-15
- Inventor: Robert C. Hedtke , David A. Broden
- Applicant: Robert C. Hedtke , David A. Broden
- Applicant Address: US MN Eden Prairie
- Assignee: Rosemount Inc.
- Current Assignee: Rosemount Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G01L13/02
- IPC: G01L13/02

Abstract:
A coplanar process fluid pressure sensor module is provided. The module includes a coplanar base and a housing body. The coplanar base has a pair of process fluid pressure inlets, each having an isolator diaphragm. The housing body is coupled to the coplanar base at an interface between the coplanar base and the housing body. A differential pressure sensor is operably coupled to the pair of process fluid pressure inlets, and is disposed proximate the coplanar base within the housing body.
Public/Granted literature
- US20130104663A1 COPLANAR PROCESS FLUID PRESSURE SENSOR MODULE Public/Granted day:2013-05-02
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