Invention Grant
- Patent Title: Socket and plug for high-speed connector
- Patent Title (中): 插头和插头用于高速连接器
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Application No.: US13758718Application Date: 2013-02-04
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Publication No.: US08777673B2Publication Date: 2014-07-15
- Inventor: Baoliang Sun , Min Song , Tengfang Xiong , Wanxing Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Agent Grant Rodolph; Nicholas K. Beaulieu
- Priority: CN201110033878 20110131
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A socket and a plug for a high-speed connector configured to implement communication and transmission of multiple channels of high-speed signals are disclosed. The socket according to an embodiment of the present invention includes: a shell and pins; the shell has an opening configured to accommodate a plug for the high-speed connector; the pins include upper-layer pins and lower-layer pins; the upper-layer pins are set at one side of an inner wall of the opening, the lower-layer pins are set at the other side of the inner wall of the opening corresponding to positions of the upper-layer pins, the upper-layer pins are arranged in at least two rows of pin groups, and the at least two rows of pin groups are distributed in a staggered manner along a length direction of the pins.
Public/Granted literature
- US20130149913A1 Socket and Plug for High-Speed Connector Public/Granted day:2013-06-13
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