Invention Grant
US08779557B2 Chip package and package wafer with a recognition mark, and method for forming the same
有权
具有识别标记的芯片封装和封装晶片及其形成方法
- Patent Title: Chip package and package wafer with a recognition mark, and method for forming the same
- Patent Title (中): 具有识别标记的芯片封装和封装晶片及其形成方法
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Application No.: US13476748Application Date: 2012-05-21
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Publication No.: US08779557B2Publication Date: 2014-07-15
- Inventor: Tsang-Yu Liu , Chia-Sheng Lin , Chia-Ming Cheng , Po-Shen Lin
- Applicant: Tsang-Yu Liu , Chia-Sheng Lin , Chia-Ming Cheng , Po-Shen Lin
- Agency: Liu & Liu
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/68 ; H01L23/544
Abstract:
An embodiment of the invention provides a chip package which includes: a substrate, wherein the substrate is diced from a wafer; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a material layer formed on the insulating layer, wherein the material layer has a recognition mark, and the recognition mark shows position information of the substrate in the wafer before the substrate is diced from the wafer.
Public/Granted literature
- US20120292744A1 CHIP PACKAGE, METHOD FOR FORMING THE SAME, AND PACKAGE WAFER Public/Granted day:2012-11-22
Information query
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