Invention Grant
- Patent Title: Semiconductor device and manufacturing method
- Patent Title (中): 半导体器件及制造方法
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Application No.: US13595049Application Date: 2012-08-27
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Publication No.: US08779583B2Publication Date: 2014-07-15
- Inventor: Klaus Pressel , Gottfried Beer
- Applicant: Klaus Pressel , Gottfried Beer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/00 ; H01L23/538 ; B81B7/02 ; G01L9/00 ; B81C1/00 ; H01L21/56 ; H01L25/16 ; H01L21/683 ; H01L23/31 ; G01P1/02 ; H01L25/00 ; H04R1/04 ; H01L23/498
Abstract:
A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.
Public/Granted literature
- US20120319304A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD Public/Granted day:2012-12-20
Information query
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