发明授权
- 专利标题: Printed circuit board having electronic component
- 专利标题(中): 具有电子部件的印刷电路板
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申请号: US12923720申请日: 2010-10-05
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公开(公告)号: US08780572B2公开(公告)日: 2014-07-15
- 发明人: Doo Hwan Lee , Tae Sung Jeong
- 申请人: Doo Hwan Lee , Tae Sung Jeong
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2010-0050511 20100528
- 主分类号: H05K1/18
- IPC分类号: H05K1/18
摘要:
A printed circuit board that include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode pad, receives the electronic component, and embodies the electronic component so that the center of the base body forming the electronic component is positioned at the center of the insulating resin layer; and circuit layers that include a circuit pattern disposed on the electrode pad, form inter-layer connection, and are disposed on both surfaces of the insulating resin layer, respectively, the plating electrode pad having a thickness that conforms to a thickness from an upper surface of the electronic component to an upper surface of the insulating resin.