发明授权
- 专利标题: Heat treatment apparatus heating substrate by irradiation with light
- 专利标题(中): 热处理装置用光照射加热基板
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申请号: US13848526申请日: 2013-03-21
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公开(公告)号: US08781309B2公开(公告)日: 2014-07-15
- 发明人: Tatsufumi Kusuda
- 申请人: Tatsufumi Kusuda
- 申请人地址: JP
- 专利权人: Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人: Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Ostrolenk Faber LLP
- 优先权: JP2007-236249 20070912
- 主分类号: F26B3/30
- IPC分类号: F26B3/30 ; F26B19/00
摘要:
A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer.