Invention Grant
- Patent Title: Slab module for a raised floor
- Patent Title (中): 高架地板的板模块
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Application No.: US14011688Application Date: 2013-08-27
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Publication No.: US08782986B1Publication Date: 2014-07-22
- Inventor: Che-An Tsai
- Applicant: Che-An Tsai
- Priority: TW102207583U 20130425
- Main IPC: E04B2/00
- IPC: E04B2/00 ; E04B5/00 ; E04B9/00 ; E04B5/04 ; E04F15/02
Abstract:
A slab module includes a stone slab having a thickness of 3-10 mm. A reinforcing plate includes a first side fixed to a rear side of the stone slab. The reinforcing plate has an area corresponding to an area of the stone slab. A base is made of a rigid material and includes a coupling face on a top side thereof. The coupling face is fixed to a second side of the reinforcing plate. A plurality of posts is provided below the coupling face, with a compartment formed between the posts for receiving a wire.
Information query
