Invention Grant
- Patent Title: Copper-containing nanoparticles and manufacturing method therefor
- Patent Title (中): 含铜纳米粒子及其制造方法
-
Application No.: US13058681Application Date: 2009-08-06
-
Publication No.: US08784702B2Publication Date: 2014-07-22
- Inventor: Masami Nakamoto , Mari Yamamoto , Yukiyasu Kashiwagi , Yukio Yoshida , Hiroshi Kakiuchi , Shinsuke Matsumura
- Applicant: Masami Nakamoto , Mari Yamamoto , Yukiyasu Kashiwagi , Yukio Yoshida , Hiroshi Kakiuchi , Shinsuke Matsumura
- Applicant Address: JP Osaka-Shi JP Osaka-Shi
- Assignee: Osaka Municipal Technical Research Institute,Daiken Chemical Co., Ltd.
- Current Assignee: Osaka Municipal Technical Research Institute,Daiken Chemical Co., Ltd.
- Current Assignee Address: JP Osaka-Shi JP Osaka-Shi
- Agency: Fox Rothschild LLP
- Priority: JP2008-207524 20080811
- International Application: PCT/JP2009/063962 WO 20090806
- International Announcement: WO2010/018782 WO 20100218
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/12

Abstract:
Copper-containing nanoparticles with excellent oxidation resistance is provided. The present invention relates to a method for manufacturing copper-containing nanoparticles including obtaining copper-containing nanoparticles that contain an organic component by heat treating an organic copper compound at a temperature equal to or higher than a decomposition initiation temperature of the compound and lower than a complete decomposition temperature of the compound in a non-oxidative atmosphere in the presence of an organic material containing a 1,2-alkanediol having 5 or more carbon atoms and/or a derivative thereof.
Public/Granted literature
- US20110193034A1 COPPER-CONTAINING NANOPARTICLES AND MANUFACTURING METHOD THEREFOR Public/Granted day:2011-08-11
Information query