Invention Grant
- Patent Title: Heat stable SnAl and SnMg based dielectrics
- Patent Title (中): 耐热SnAl和SnMg基电介质
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Application No.: US13305550Application Date: 2011-11-28
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Publication No.: US08784934B2Publication Date: 2014-07-22
- Inventor: Mohd Fadzli Anwar Hassan , Richard Blacker , Guowen Ding , Muhammad Imran , Jingyu Lao , Hien Minh Huu Le , Yiwei Lu , Zhi-Wen Sun
- Applicant: Mohd Fadzli Anwar Hassan , Richard Blacker , Guowen Ding , Muhammad Imran , Jingyu Lao , Hien Minh Huu Le , Yiwei Lu , Zhi-Wen Sun
- Applicant Address: US CA San Jose US MI Auburn Hills
- Assignee: Intermolecular, Inc.,Guardian Industries
- Current Assignee: Intermolecular, Inc.,Guardian Industries
- Current Assignee Address: US CA San Jose US MI Auburn Hills
- Main IPC: B05D5/06
- IPC: B05D5/06

Abstract:
A transparent dielectric composition comprising tin, oxygen and one of aluminum or magnesium with preferably higher than 15% by weight of aluminum or magnesium offers improved thermal stability over tin oxide with respect to appearance and optical properties under high temperature processes. For example, upon a heat treatment at temperatures higher than 500 C, changes in color and index of refraction of the present transparent dielectric composition are noticeably less than those of tin oxide films of comparable thickness. The transparent dielectric composition can be used in high transmittance, low emissivity coated panels, providing thermal stability so that there are no significant changes in the coating optical and structural properties, such as visible transmission, IR reflectance, microscopic morphological properties, color appearance, and haze characteristics, of the as-coated and heated treated products.
Public/Granted literature
- US20130136932A1 Heat Stable SnAl and SnMg Based Dielectrics Public/Granted day:2013-05-30
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