Invention Grant
US08785103B2 Photosensitive novolac resin, positive photosensitive resin composition including same, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
有权
光敏酚醛清漆树脂，含有它的正型感光性树脂组合物，使用该感光性树脂组合物的感光性树脂膜，以及含有感光性树脂膜
- Patent Title: Photosensitive novolac resin, positive photosensitive resin composition including same, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
- Patent Title (中): 光敏酚醛清漆树脂，含有它的正型感光性树脂组合物，使用该感光性树脂组合物的感光性树脂膜，以及含有感光性树脂膜
-
Application No.: US13590440Application Date: 2012-08-21
-
Publication No.: US08785103B2Publication Date: 2014-07-22
- Inventor: Jong-Hwa Lee , Hyun-Yong Cho , Min-Kook Chung , Ji-Young Jeong , Myoung-Hwan Cha
- Applicant: Jong-Hwa Lee , Hyun-Yong Cho , Min-Kook Chung , Ji-Young Jeong , Myoung-Hwan Cha
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins, Pendleton & Ashe, P.A.
- Priority: KR10-2011-0146190 20111229
- Main IPC: G03F7/023
- IPC: G03F7/023
Abstract:
Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.
Public/Granted literature
Information query
IPC分类:
