Invention Grant
- Patent Title: Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly
- Patent Title (中): 优化多回路层压复合组件结构布局的方法与装置
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Application No.: US13799998Application Date: 2013-03-13
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Publication No.: US08785784B1Publication Date: 2014-07-22
- Inventor: James D. Duford , James D. Jore , Lincoln M. Jore , James S. Smith
- Applicant: Boulder Wind Power, Inc.
- Applicant Address: US CO Louisville
- Assignee: Boulder Wind Power, Inc.
- Current Assignee: Boulder Wind Power, Inc.
- Current Assignee Address: US CO Louisville
- Agency: Cooley LLP
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02
Abstract:
A laminated composite assembly includes a layer having a first conductor with a first side and a second side. A first electric insulator is disposed between the first side of the first conductor and a second conductor such that a difference between a voltage associated with the first conductor and a voltage associated with the second conductor defines a voltage stress therebetween. The first electric insulator providing a first degree of electrical isolation based on the voltage stress. A second electric insulator is disposed between the second side of the first conductor and a third conductor such that a difference between the voltage associated with the first conductor and a voltage associated with the third conductor defines a second voltage stress therebetween. The second electric insulator providing a second degree of electrical isolation based on the second voltage stress.
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