发明授权
- 专利标题： Chip package and method for forming the same
- 专利标题（中）： 芯片封装及其形成方法
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申请号： US13359452申请日： 2012-01-26
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公开(公告)号： US08786093B2公开(公告)日： 2014-07-22
- 发明人: Chia-Sheng Lin , Tzu-Hsiang Hung
- 申请人： Chia-Sheng Lin , Tzu-Hsiang Hung
- 代理机构： Liu & Liu
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44 ; H01L23/60 ; H01L23/522 ; H01L23/31 ; H01L23/00 ; H01L21/768
摘要：
An embodiment of the invention provides a chip package which includes: a substrate; a device region disposed in or on the substrate; a signal pad disposed in or on the substrate and electrically connected to the device region; a ground pad disposed in or on the substrate; a signal bump disposed on a surface of the substrate, wherein the signal bump is electrically connected to the signal pad through a signal conducting layer; a ground conducting layer disposed on the surface of the substrate and electrically connected to the ground pad; and a protection layer disposed on the surface of the substrate, wherein the protection layer completely covers the entire side terminals of the signal conducting layer and partially covers the ground conducting layer such that a side terminal of the ground conducting layer is exposed on a side of the substrate.
公开/授权文献
- US20120193786A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 公开/授权日：2012-08-02
信息查询
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