Invention Grant
US08786965B2 Die processing method, die, objective lens, and optical pick-up device
有权
模具加工方法,模具,物镜和光学拾取装置
- Patent Title: Die processing method, die, objective lens, and optical pick-up device
- Patent Title (中): 模具加工方法,模具,物镜和光学拾取装置
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Application No.: US13498575Application Date: 2010-08-17
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Publication No.: US08786965B2Publication Date: 2014-07-22
- Inventor: Kenichi Ishii , Kyu Takada
- Applicant: Kenichi Ishii , Kyu Takada
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP2009-227874 20090930
- International Application: PCT/JP2010/063860 WO 20100817
- International Announcement: WO2011/040135 WO 20110407
- Main IPC: G02B3/02
- IPC: G02B3/02 ; G02B3/00 ; G11B7/1374

Abstract:
A method for processing a material for a die for molding an objective lens which is formed with a multilevel structure on the curved surface thereof, wherein the transfer surface of the objective lens is cut by a tool having a cutting face, the outline of which includes a linear first edge portion, a linear second edge portion extending in a direction which intersects the first edge portion at an acute angle thereto, and a third edge portion which joins the ends of the first and second edge portions, while the die material is rotated around the axis thereof, in a state in which at least the first edge portion and the second edge portion of the tool is inclined with respect to the axis and while the tool is moved only in the axial direction and in the direction which intersects the axis.
Public/Granted literature
- US20120182628A1 Die Processing Method, Die, Objective Lens, and Optical Pick-Up Device Public/Granted day:2012-07-19
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B3/00 | 简单或复合透镜 |
G02B3/02 | .具有非球面的(G02B3/10优先) |