Invention Grant
- Patent Title: Low inductance capacitor module and power system with low inductance capacitor module
- Patent Title (中): 低电感电容模块和低电感电容模块电力系统
-
Application No.: US13271491Application Date: 2011-10-12
-
Publication No.: US08787003B2Publication Date: 2014-07-22
- Inventor: Daniel Domes , Reinhold Bayerer
- Applicant: Daniel Domes , Reinhold Bayerer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/008 ; H01G4/06 ; H01G2/08 ; H01G9/00 ; H05K5/02

Abstract:
According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.
Public/Granted literature
- US20130094122A1 Low Inductance Capacitor Module and Power System with Low Inductance Capacitor Module Public/Granted day:2013-04-18
Information query