发明授权
US08787025B2 Electronic module with improved latch mechanism 有权
具有改进的闩锁机构的电子模块

  • 专利标题: Electronic module with improved latch mechanism
  • 专利标题(中): 具有改进的闩锁机构的电子模块
  • 申请号: US13405599
    申请日: 2012-02-27
  • 公开(公告)号: US08787025B2
    公开(公告)日: 2014-07-22
  • 发明人: Jerry Wu
  • 申请人: Jerry Wu
  • 申请人地址: TW New Taipei
  • 专利权人: Hon Hai Precision Industry Co., Ltd.
  • 当前专利权人: Hon Hai Precision Industry Co., Ltd.
  • 当前专利权人地址: TW New Taipei
  • 代理商 Ming Chieh Chang; Wei Te Chung
  • 优先权: CN201110046801 20110225
  • 主分类号: H05K1/14
  • IPC分类号: H05K1/14
Electronic module with improved latch mechanism
摘要:
An electronic module for mating with a complementary connector, comprises: a housing, a printed circuit board disposed in the housing, a slider member movably received in the channel, a cover member confining the slider member to the housing, a gasket mounted to the housing and having a pair of engaging portions, and an ejector located above on the slider member. The slider member has a body portion and a pair of arm portions extending forwardly from the body portion. The ejector is located above the pair of arm portions, and has a pair of cantilever portions pivotable outward, in response to a sliding movement of the slider member, against the pair of engaging portions.
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