Invention Grant
- Patent Title: Actuatable device with die and integrated circuit element
- Patent Title (中): 带芯片和集成电路元件的可执行器件
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Application No.: US14070273Application Date: 2013-11-01
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Publication No.: US08789924B2Publication Date: 2014-07-29
- Inventor: Andreas Bibl , Deane A. Gardner , John A. Higginson , Kevin von Essen
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fish & Richardson P.C.
- Main IPC: B41J2/16
- IPC: B41J2/16

Abstract:
A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator.
Public/Granted literature
- US20140055528A1 ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT Public/Granted day:2014-02-27
Information query
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