A header connector includes a housing configured to be mounted to a mounting surface of the circuit board and header contacts held by the housing. The header contacts have mating portions and mounting portions. The mounting portions are configured to be surface mounted to corresponding pads on the circuit board. A spring clip is coupled to the housing. The spring clip has a spring finger extending through the circuit board to engage a bottom side of the circuit board opposite the mounting surface of the circuit board. The spring clip pulls the housing and header contacts toward the mounting surface.