Invention Grant
- Patent Title: Hexagonal boron nitride sheet, method of preparing the hexagonal boron nitride sheet, and electronic device including the hexagonal boron nitride sheet
- Patent Title (中): 六方氮化硼片，六方氮化硼片的制造方法以及包含六方氮化硼片的电子器件
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Application No.: US13705700Application Date: 2012-12-05
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Publication No.: US08790775B2Publication Date: 2014-07-29
- Inventor: Sang-Woo Kim , Hyeon-Jin Shin , Jae-young Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2011-0129913 20111206
- Main IPC: H01L31/042
- IPC: H01L31/042
Abstract:
A hexagonal boron nitride sheet having: a two-dimensional planar structure with a sp2 B—N covalent bond, a Van der Waals bond between boron-nitrogen layers, a root mean square surface roughness of about 2 nanometers or less, and a length of about 1 millimeter or greater.
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