发明授权
US08791712B2 3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts
有权
使用具有钨锥触点的MEMS开关的三维集成电路测试
- 专利标题： 3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts
- 专利标题（中）： 使用具有钨锥触点的MEMS开关的三维集成电路测试
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申请号： US13364345申请日： 2012-02-02
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公开(公告)号： US08791712B2公开(公告)日： 2014-07-29
- 发明人: John J. Ellis-Monaghan , Jeffrey P. Gambino , Kirk D. Peterson , Jed H. Rankin
- 申请人： John J. Ellis-Monaghan , Jeffrey P. Gambino , Kirk D. Peterson , Jed H. Rankin
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb & Riley, LLC
- 代理商 Michael J. LeStrange, Esq.
- 主分类号： G01R1/067
- IPC分类号： G01R1/067
摘要：
A test system for testing a multilayer 3-dimensional integrated circuit (IC), where two separate layers of IC circuits are temporarily connected in order to achieve functionality, includes a chip under test with a first portion of the 3-dimensional IC, and a test probe chip with a second portion of the 3-dimensional IC and micro-electrical-mechanical system (MEMS) switches that selectively complete functional circuits between the first portion of the 3-dimensional IC in a first IC layer to circuits within the second portion of the 3-dimensional IC in a second IC layer. The MEMS switches include tungsten (W) cone contacts, which make the selective electrical contacts between circuits of the chip under test and the test probe chip and which are formed using a template of graded borophosphosilicate glass (BPSG).