Invention Grant
- Patent Title: Coil device
- Patent Title (中): 线圈装置
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Application No.: US13645311Application Date: 2012-10-04
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Publication No.: US08791786B2Publication Date: 2014-07-29
- Inventor: Hiroshi Maeda , Terumasa Toyoda , Kiho Hwang , Sukho Shin
- Applicant: TDK Corporation , TDK Korea Corporation
- Applicant Address: JP Tokyo KR Seoul
- Assignee: TDK Corporation,TDK Korea Corporation
- Current Assignee: TDK Corporation,TDK Korea Corporation
- Current Assignee Address: JP Tokyo KR Seoul
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2011-221292 20111005
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F21/06 ; H01F27/30 ; H01F27/24 ; H01F27/34 ; H01F27/32 ; H01F5/00

Abstract:
A coil device 10 comprises a first bobbin 40 having a first bobbin plate 42 provided with a first hollow cylinder 44 on which a primary coil 20 is wound at the outer periphery, and a second bobbin 50 mounted on the first bobbin 40 and having a second bobbin plate 52 provided with a second hollow cylinder 54 on which a secondary coil 30 is wound at the outer periphery. A winding center C1 of the primary coil 20 and a winding center C2 of the secondary coil 30 displace with a predetermined displacement (Lx) along a predetermined reference direction X.
Public/Granted literature
- US20130154787A1 COIL DEVICE Public/Granted day:2013-06-20
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