Invention Grant
- Patent Title: Near field coupling devices and associated systems and methods
- Patent Title (中): 近场耦合装置及相关系统和方法
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Application No.: US14028356Application Date: 2013-09-16
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Publication No.: US08791874B2Publication Date: 2014-07-29
- Inventor: Boris Y. Tsirline , Mao Tian , Karl Torchalski
- Applicant: ZIH Corp.
- Applicant Address: US IL Lincolnshire
- Assignee: ZIH Corp.
- Current Assignee: ZIH Corp.
- Current Assignee Address: US IL Lincolnshire
- Agency: Alston & Bird LLP
- Main IPC: H01Q3/24
- IPC: H01Q3/24

Abstract:
A near-field coupling device that may facilitate communications with a transponder is provided. The near-field coupling device may include a ground plane, a dielectric substrate, one or more conductive strips and a terminating load. The conductive strips together with the ground planes form coupling elements. The near-field coupling device further includes one or more switching elements for selectively connecting and disconnecting the coupling elements with a transceiver. The connected coupling elements define a total characteristic impedance. Using the switching element, the ratio between the total characteristic impedance of the connected coupling elements and the terminating load may be changed in order to adjust the distribution of an electromagnetic field along the coupling elements according to the type and position of the transponder to be processed.
Public/Granted literature
- US20140071020A1 Near Field Coupling Devices and Associated Systems and Methods Public/Granted day:2014-03-13
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