发明授权
- 专利标题: Laser cooling of modified SOI wafer
- 专利标题(中): 改性SOI晶片的激光冷却
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申请号: US12966394申请日: 2010-12-13
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公开(公告)号: US08794010B2公开(公告)日: 2014-08-05
- 发明人: David L. Williams , Andrew Clark , Michael Lebby
- 申请人: David L. Williams , Andrew Clark , Michael Lebby
- 申请人地址: US CA Palo Alto
- 专利权人: Translucent, Inc.
- 当前专利权人: Translucent, Inc.
- 当前专利权人地址: US CA Palo Alto
- 主分类号: H01S3/30
- IPC分类号: H01S3/30 ; H01S3/034 ; F25B23/00 ; F25B21/00
摘要:
A laser cooling system includes a substrate, an REO layer of single crystal rare earth oxide including at least one rare earth element positioned on the surface of the substrate, and an active layer of single crystal semiconductor material positioned on the REO layer to form a semiconductor-on-insulator (SOI) device. Light guiding structure is at least partially formed by the REO layer so as to introduce energy elements into the REO layer and produce cooling by anti-Stokes fluorescence. The active layer of single crystal semiconductor material is positioned on the REO layer in proximity to the light guiding structure so as to receive the cooling.
公开/授权文献
- US20120147906A1 LASER COOLING OF MODIFIED SOI WAFER 公开/授权日:2012-06-14
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