发明授权
- 专利标题: Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)
- 专利标题(中): 利用原位测量技术结合热电芯片(TEC)的方法和装置
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申请号: US13270522申请日: 2011-10-11
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公开(公告)号: US08794011B2公开(公告)日: 2014-08-05
- 发明人: Alton H. Phillips , Akio Ohta , Douglas C. Watson
- 申请人: Alton H. Phillips , Akio Ohta , Douglas C. Watson
- 申请人地址: JP Tokyo
- 专利权人: Nikon Corporation
- 当前专利权人: Nikon Corporation
- 当前专利权人地址: JP Tokyo
- 主分类号: F25B21/02
- IPC分类号: F25B21/02
摘要:
According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.
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