发明授权
US08794011B2 Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs) 有权
利用原位测量技术结合热电芯片(TEC)的方法和装置

Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)
摘要:
According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.
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