发明授权
- 专利标题： Thermal sensing structure and insulating structure of thermal sensing circuit
- 专利标题（中）： 热感应电路的热敏结构和绝缘结构
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申请号： US12654401申请日： 2009-12-18
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公开(公告)号： US08794827B2公开(公告)日： 2014-08-05
- 发明人: Satoshi Ishikawa , Susumu Yamamoto
- 申请人： Satoshi Ishikawa , Susumu Yamamoto
- 申请人地址： JP Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Edwards Wildman Palmer LLP
- 优先权： JP2009-021120 20090202; JP2009-028412 20090210
- 主分类号： G01K5/00
- IPC分类号： G01K5/00
摘要：
Flexible circuits 2, 3 are formed on a flexible insulating sheet 1. A thermal sensor 4 is connected between the circuits 2, 3. The thermal sensor 4 and connecting parts 5 are integrally covered with an elastic insulating resin 6. While the insulating sheet 1 is bent together with the insulating resin 6, the thermal sensor 4 is pushed onto an object to be sensed 8 via the insulating sheet 1. A plurality of thermal sensors 4 are connected in series in a longitudinal direction of the insulating sheet 1. The insulating resin 6 covers the thermal sensors 4 and the connecting parts 5.