发明授权
- 专利标题: Transparent conductive substrate
- 专利标题(中): 透明导电基板
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申请号: US13696879申请日: 2011-05-11
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公开(公告)号: US08795786B2公开(公告)日: 2014-08-05
- 发明人: Syozou Kawazoe , Kenji Hashimoto
- 申请人: Syozou Kawazoe , Kenji Hashimoto
- 申请人地址: JP Osaka
- 专利权人: Meihan Shinku Kogyo Co., Ltd.
- 当前专利权人: Meihan Shinku Kogyo Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2010-109960 20100512
- 国际申请: PCT/JP2011/060869 WO 20110511
- 国际公布: WO2011/142392 WO 20111117
- 主分类号: H01L33/42
- IPC分类号: H01L33/42
摘要:
Disclosed are a transparent conductive substrate comprising a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate, the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface that is opposite to the surface that is in contact with the transparent conductive thin film layer being larger than those at the surface that is in contact with the transparent conductive thin film layer; and a method for producing the transparent conductive substrate, comprising forming the transparent metal oxide layer on the surface of the transparent conductive thin film layer or transparent conductive thin film layers by oblique deposition.
公开/授权文献
- US20130056050A1 TRANSPARENT CONDUCTIVE SUBSTRATE 公开/授权日:2013-03-07
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