Invention Grant
- Patent Title: Bonding apparatus and method for display device
- Patent Title (中): 显示装置的接合装置和方法
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Application No.: US13892120Application Date: 2013-05-10
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Publication No.: US08796051B2Publication Date: 2014-08-05
- Inventor: Deok-Jun Choi
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Christie, Parker & Hale, LLP
- Priority: KR10-2012-0114825 20121016
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A bonding apparatus for a display device includes a film bonding device for bonding an anisotropic conductive film to a display substrate; and a pressure device for bonding a driving chip to the anisotropic conductive film of the display substrate, wherein the pressure device includes a pressure head with a heat source, and a pressure tip attached to a lower surface of the pressure head and including a plurality of sub-pressure tips that are separated from each other.
Public/Granted literature
- US20140106484A1 BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE Public/Granted day:2014-04-17
Information query
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