Invention Grant
US08796117B2 Structure of high electron mobility transistor growth on Si substrate and the method thereof
有权
Si衬底上高电子迁移率晶体管生长的结构及其方法
- Patent Title: Structure of high electron mobility transistor growth on Si substrate and the method thereof
- Patent Title (中): Si衬底上高电子迁移率晶体管生长的结构及其方法
-
Application No.: US13561977Application Date: 2012-07-30
-
Publication No.: US08796117B2Publication Date: 2014-08-05
- Inventor: Edward Yi Chang , Shih-Hsuan Tang , Yueh-Chin Lin
- Applicant: Edward Yi Chang , Shih-Hsuan Tang , Yueh-Chin Lin
- Applicant Address: TW Hsinchu
- Assignee: National Chiao Tung University
- Current Assignee: National Chiao Tung University
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW100130732A 20110826
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
A structure of high electron mobility transistor growth on Si substrate and the method thereof, in particular used for the semiconductor device manufacturing in the semiconductor industry. The UHVCVD system was used in the related invention to grow a Ge film on Si substrate then grow the high electron mobility transistor on the Ge film for the reduction of buffer layer thickness and cost. The function of the Ge film is preventing the formation of silicon oxide when growing III-V MHEMT structure in MOCVD system on Si substrate. The reason of using MHEMT in the invention is that the metamorphic buffer layer in MHEMT structure could block the penetration of dislocation which is formed because of the very large lattice mismatch (4.2%) between Ge and Si substrate.
Public/Granted literature
- US20130049070A1 STRUCTURE OF HIGH ELECTRON MOBILITY TRANSISTOR GROWTH ON SI SUBSTRATE AND THE METHOD THEREOF Public/Granted day:2013-02-28
Information query
IPC分类: